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TMI offers the additional benefit of "Value Added Services" which provide "Turn-Key" material. This insures the parts are
delivered ready to go to the manufacturing floor.
Robotic Hot Solder Dip (RHSD) – For Tin Whisker Mitigation
- U.S Navy-qualified process removes 100% of pure tin and replaces it with SnPb (tin-lead).
Robotic Hot Solder Dip (RHSD) – For Gold Mitigation
- Removes gold and replaces it with SnPb.
- Typically required to cover the effective seating plane.
Robotic Hot Solder Dip (RHSD) – For RoHS Compliance
- Replaces the SnPb and replaces it with SAC305 (tin, silver, copper) or any other specified alloy.
Trim and Form
- Forms and trims straight leads for surface mount placement.
Lead Re-Conditioning
- Robotic process realigns leads that are bent and scans to verify results.
XRF – X-Ray Fluorescence Analysis
- Used to determine Lead content of Termination Finishes and Plating Thickness.
Tape and Reel
- Tape and Reel following the process in the quantities desired for issue to the production floor.
Kitting
- Components are packaged in quantities and packaged that are process friendly.
Component Reutilization
- The removal of critical components from PCB’s for return and reuse.
Electrical Testing
- Testing component functionality to the Manufacturers specification.
Component Programming
- Programming components to the Manufacturers or end users algorithms.
Authenticity Testing
- The process of examining and verifying the component is authentic and not suspect or counterfeit.
- The process requires samples to be used for decapsulation and x-ray to insure the original die,
wire bonds, lead integrity and finish.
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